Thermal paste computer cpu

1 gram. Send at random. Easy-to-use Syringes. Easy to remove too. High thermal conductivity, low bleed, stable at high temperatures. Thermal conductivity: >0.65 W/m-k. Suitable for CPU, chipsets on Mainboard, VGA card, etc.

KRYONAUT The  Kryonaut thermal  paste was specially developed for the extremely demanding applications and the highest demands of the overlocking community.  Kryonaut  is also recommended as a top product for critical cooling systems in the industrial sector. Especially for overclocking Excellent thermal conductivity No curing High long-term stability Not electrically conductive Applicable to aluminum coolers (warning label is exclusively for Conductonaut!) operation area Rating Thermal conductivity ***** Sub-zero overclocking ***** Overclocking ***** Water cooling ***** Air cooling ***** Silicone sensitive applications - "Kryo" - the Greek word for "cold", which is also used in cryotechnology - indicates that the   Kryonaut  thermal paste is specially designed for use in the low-temperature range - it was developed for the true "cryonauts" among the "extreme overclockers". Kryonaut  uses a special support structure that does not begin to dry out even at 80 ° C. This support structure ensures that the nano-aluminium and zinc oxide components of the paste are optimally combined and unevenness in the heat carrier (e.g. the CPU) and a heat sink (e.g. heat sink) are optimally compensated for with excellent thermal conductivity.

Thermal Grease Paste Compound Silicone for CPU Heat Sink The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards. Thermal coupling of electrical / electronic device to heat sinks High Thermal Conductivity, Low Bleed and Stable at high temperature

Easy-to-use Syringes. Easy to remove too. High thermal conductivity, low bleed, stable at high temperatures. Thermal conductivity: >0.65 W/m-k. Suitable for CPU, chipsets on Mainboard, VGA card, etc.

Clean up the surface. Use Thermal Grease on the CPU/GPU surface center. Using scraper or other tools to smear the thermal paste onto the CPU. After coating the product，the thickness is based on A4 paper thickness. Color:Gray Specific Gravity: 2.3 G/Cc Thermal Conductivity: 4.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application. High Viscosity Allows For Easy Application Nanotechnology Improves Heat Conduction Non-electric Conductive Material Ensure Safe Usage Low Evaporation Point & High Temperature Tolerance Spreader Allows For Quick & Easy Application Thermal Conductivity > 5.15W/m-K Specification Features - High Viscosity Allows For Easy Application - Nanotechnology Improves Heat Conduction - Non-electric Conductive Material Ensure Safe Usage - Low Evaporation Point & High Temperature Tolerance - Spreader Allows For Quick & Easy Application - Thermal Conductivity > 5.15W/m-K

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application. High Viscosity Allows For Easy Application Nanotechnology Improves Heat Conduction Non-electric Conductive Material Ensure Safe Usage Low Evaporation Point & High Temperature Tolerance Spreader Allows For Quick & Easy Application Thermal Conductivity > 5.15W/m-K

GD900 Thermal Paste Grease Heat Sink Compound High Performance Net Weight 1 Gram For CPU GPU Cooler Gray Conductive Cooling Fan Processors Silicone Plaster

1.High Grade Stability And Reliability. 2.Apply to CPU, VGA, Chipset, Radiator And Other PC Components. 3.Helps Disperse The Heat From CPU To Heatsink Effectively. 4.Low Thermal Resistance And High Conductivity For Superior Heat Transfer. 5.High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.

99.99% brand new and high quality thermal grease paste Non-toxic, tasteless, non-corrosive High stability and reliability Low thermal resistance and high thermal conductivity Apply to CPU, VGA,LED Chipset and other PC components Compliance with RoHS REACH PFOS requirement Material: Silicone Grease Net Weight: 10g Thermal conductivity: > 1.93 W/m-k Thermal Impedance: <0.225 Specific Gravity: >2.0 Viscosity: 1000 Concentration: 380±10 1/10mm Working temperature: ?50-300°

High Grade Stability And Reliability. Apply to CPU, VGA, Chipset, Radiator And Other PC Components. Helps Disperse The Heat From CPU To Heatsink Effectively. Low Thermal Resistance And High Conductivity For Superior Heat Transfer. High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.

High grade stability and reliability. Apply to CPU, VGA, chipset, radiator and other PC components. Helps disperse the heat from CPU to heatsink effectively. Low thermal resistance and high conductivity or superior heat transfer. High temperature resistance. Non-toxic, tasteless, non-corrosive.

2 pack - 1 gram. Send at random. Easy-to-use Syringes. Easy to remove too. High thermal conductivity, low bleed, stable at high temperatures. Thermal conductivity: >0.65 W/m-k. Suitable for CPU, chipsets on Mainboard, VGA card, etc.

Hi up for sale is halnziye hy880 thermal grease. This is the best one from halnziye. Far far better then locally available generic brands whose thermal conductivity is hardly 1.5.. This halnziye hy880 has thermal conductivity value of 5.15. I am using it on my xeon processor very satisfied with its working. For given amount you will get enough to apply 4 times on processor sized equal to xeon E5620. Qty is one full insulin syringe

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed, and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. Suitable for CPU, chipsets on Mainboard, VGA card, etc. Easy to use. ZIF Socket Templates ensure correct applying area with various CPU socket types. Produces an even layer when using the applicator. Dielectric. Wide range of application temperature