Gd900 thermal paste grease sink compound high

GD900 Thermal Paste Grease Heat Sink Compound High Performance Net Weight 1 Gram For CPU GPU Cooler Gray Conductive Cooling Fan Processors Silicone Plaster

Clean up the surface. Use Thermal Grease on the CPU/GPU surface center. Using scraper or other tools to smear the thermal paste onto the CPU. After coating the product，the thickness is based on A4 paper thickness. Color:Gray Specific Gravity: 2.3 G/Cc Thermal Conductivity: 4.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit

Features: High Quality thermal Paste, Grease High conductivity, low bleed, stable at high temperatures. Type: silicone fluid with 20% metal oxide. Thermal conductivity: >0.65 W/m-k. Thermal resistance: >0.262 C-in2/w. Dielectric breakdown: >5.0 KV ac. Weight of each tube: 1g. Suitable for CPU, VGA, Heat sink, Peltier What is Included in this Package ?: 1 x Thermal Grease Note: Price is for single item only

Thermal Grease Paste Compound Silicone for CPU Heat Sink The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards. Thermal coupling of electrical / electronic device to heat sinks High Thermal Conductivity, Low Bleed and Stable at high temperature

Features: Brand new & High Quality. High conductivity, low bleed, stable at high temperatures. Type: silicone fluid with 20% metal oxide. Thermal conductivity: >0.65 W/m-k. Thermal resistance: >0.262 C-in2/w. Dielectric breakdown: >5.0 KV ac. Weight of each tube: 1g. Suitable for CPU, VGA, Heat sink, Peltier Package Included: 1 x Thermal Compound

99.99% brand new and high quality thermal grease paste Non-toxic, tasteless, non-corrosive High stability and reliability Low thermal resistance and high thermal conductivity Apply to CPU, VGA,LED Chipset and other PC components Compliance with RoHS REACH PFOS requirement Material: Silicone Grease Net Weight: 10g Thermal conductivity: > 1.93 W/m-k Thermal Impedance: <0.225 Specific Gravity: >2.0 Viscosity: 1000 Concentration: 380±10 1/10mm Working temperature: ?50-300°

this paste is basically a thermally conductive material. this paste used as an interface between the heat sink and heat sources. this paste can be used in high-power semiconductor devices. this heat sink paste is used to fill the space and all imperfections on the heat sink. Non-toxic,tasteless,non-corrosive Primary Use:Thermal coupling of electrical/electronic devices to heat sinks Special Properties:High conductivity;low bleed;Stable at high temperatures it has the capability of withholding 300-degree centigrades. it saves the loss of heat which causes the loss in the heat sink’s performance.